Electrical and Electronic Engineering News
Faculty
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November 6, 2019
Prof. Kenichi Okada awarded the 18th DOCOMO Mobile Science Award
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September 12, 2019
Four Tokyo Tech researchers receive 2019 Suematsu Digital Technology Award
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March 1, 2019
Tinier and less power-hungry quantum atomic clock push toward intelligent IoT
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March 1, 2019
Gearing up for 5G: A miniature, low-cost transceiver for fast, reliable communications
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March 1, 2019
An ultra-low-power frequency synthesizer targeted for IoT devices: Digital PLL achieves a power consumption of 0.265 mW
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October 1, 2018
Yota Takamura, Assitant Professor in Nakagawa group, receives Young Scientist Presentation Award.
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July 9, 2018
Professor Akagi attends IEEE Honors Ceremony
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May 1, 2018
Specially Appointed Professor Akagi Receives IEEE Medal
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August 24, 2017
Prof. Akira Chiba and Three Tokyo Tech Researchers Receive the IEEE Transactions on Energy Conversion Best Paper Award
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February 21, 2017
Plasmas promote protein introduction in plants
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February 8, 2017
Matsuzawa and Okada Laboratory won NE Analog Innovation Award
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December 19, 2016
Ultra-high-speed optical fiber sensor enables detection of structural damage in real time
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December 14, 2016
3D solutions to energy savings in silicon power transistors
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November 22, 2016
Wearable terahertz scanning device for inspection of medical equipment and the human body
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October 28, 2016
Exploring defects in nanoscale devices for possible quantum computing applications
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September 20, 2016
Mutsuko Hatano - Diamonds as the ultimate semiconductors
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August 18, 2016
Promoting large-scale power electronics research with private sector partners ― Professor Hirofumi Akagi
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August 18, 2016
Harnessing the potential of unexplored terahertz waves ― Associate Professor Yukio Kawano
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August 18, 2016
Dreaming of wireless technology surpassing wired communication ― Associate Professor Kenichi Okada
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July 4, 2016
Development of Circuit Technology that Resolves Issues with High-Frequency Piezoelectric Resonators
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May 18, 2016
Lasers on silicon: Low temperature heterogeneous integration without glue
