Electrical and Electronic Engineering News

Paper Prize of IEEE Open Journal of Industry Applications

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July 8, 2025

Fares S. El-Faouri, Yifei Cai, and Professor Akira Chiba of the Department of Electrical and Electronic Engineering at the Tokyo Institute of Science (formerly Tokyo Institute of Technology) have been awarded the 2024 Third Paper Award by the IEEE Open Journal of Industry Applications for their outstanding research on vibration and noise reduction in switched reluctance motors (SRMs). The award ceremony will be held at the IAS Annual Meeting in Taipei, Taiwan on June 20, 2025.

Award Ceremony

Award Ceremony　/Professor Akira Chiba(Center of photo）

Their winning paper, "Refinement of Analytical Current Waveform for Acoustic Noise Reduction in Switched Reluctance Motor," proposes a new approach that can effectively suppress acoustic noise and vibration even under high torque conditions. The proposed current waveform also has the advantage of having significantly lower current peaks than conventional approaches and does not require a high-capacity inverter.

Dr. Faouri said the following about this result: "Switched reluctance motors are considered one of the alternatives in the event that the supply chain of rare earth permanent magnets is disrupted. However, issues of noise and torque ripple are major barriers to their practical use in the electric vehicle industry. We hope that this method will contribute to overcoming these challenges."

This research was carried out in collaboration with researchers and students from Tokyo Institute of Science, utilizing its many years of knowledge on reducing motor noise. Dr. Faouri expressed his deep gratitude for the great support and encouragement he received from his mentors, colleagues and family during the project.

This result demonstrates the important role of Tokyo Institute of Science in the development of innovative engineering solutions. It is expected to contribute to fields where noise and vibration suppression is required, especially in the EV industry.